Wafer Pre Aligner

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Universal Semicon Technology
[Korea]

Address: 39-1 Deokseongsandan 1-ro 28beon-gil ldong-eup Cheoin-gu Yongin-si Gyeonggi-do

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Wafer Pre Aligner Feature

- Wafer Size (2inch ~ 18inch)

- Notch, Flat Wafer, Ring Type, Thin Wafer (50um)

- Si, Glass, Film, Sapphire

- Compact Size

- Fast Alignment (< 3.5sec)

- High Performance Accuracy and Repeatability

- Easy to use and Install

- Ethernet , RS-232 Communication

- Auto Detect function of Notch and Flat Type

- Si, Glass, Sapphire Type Simultaneous use

- Wafer Edge Crack and Broken Detect

- 2inch ~ 12inch Simultaneous use (CCD Stage Moving Type)

- Poor Coating and Cracked wafer support alignment

- Crack Point's degree and quantity information output function (max. 500ea)

- Covered Tape at Notch point by Laminator support alignment

Wafer Vision Function by CCD

- Compact Embedded System PC (Window XP OS)

- Vision Function and Monitoring

- Easy Monitoring and Capture Screen

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